Daily digests (5-8 items/day).
The foundation stone for India's first advanced 3D semiconductor packaging unit was laid at Info Valley, Bhubaneswar, on 19 April 2026. Promoted by 3D Glass Solutions as a Heterogeneous Integration Packaging Solutions project, it involves nearly ₹2,000 crore investment and is meant for AI, high-performance computing, defence and telecom chips.
19 Apr 2026
Protecting monuments often clashes with building around them, and ASI sits in the middle.
18 Apr 2026
With a sovereign-backed pool, Indian ships depend less on foreign insurers.
18 Apr 2026
Productivity numbers are the simple test of how well Parliament used its time.
18 Apr 2026
More women in the services makes the bureaucracy look more like the country it serves.
18 Apr 2026
The extension gives time to finish rural roads already sanctioned.
18 Apr 2026
Extra lines add capacity for both freight and passengers on crowded routes.
18 Apr 2026
Planning by river basin treats surface and groundwater as one system, which is how water actually behaves.
17 Apr 2026
TEPA is unusual because it links trade concessions to investment promises; this dialogue checks progress.
17 Apr 2026
The number of recognised startups shows how deep the ecosystem is getting.
17 Apr 2026