UPSC Mains 2025 · GS Paper III · Q16

UPSC Mains 2025 GS3 Q16: model answer

India aims to become a semiconductor manufacturing hub. What are the challenges faced by the semiconductor industry in India ? Mention the salient features of the India Semiconductor Mission.

15 marks250 wordsDirective: What are

What the question wants

Challenges for chip-making in India and features of ISM.

How to structure it

Intro: why chips matter. Body: (1) Challenges (capital, technology, infrastructure); (2) India Semiconductor Mission (ISM); (3) Progress. Conclusion: India can begin with mature nodes and packaging, where demand is large, and climb up gradually.

How to structure the answer
IntroductionWhy chips matter
Main body
  1. 1(1) Challenges (capital, technology, infrastructure)
  2. 2(2) India Semiconductor Mission (ISM)
  3. 3(3) Progress
ConclusionIndia can begin with mature nodes and packaging, where demand is large, and climb up gradually

Model answer

Semiconductors run everything from phones to missiles. India imports almost all its chips, and global supply shocks during COVID-19 showed the risk.

Challenges

  • Capital: a modern fab costs billions of dollars and takes years to break even.
  • Technology: leading-edge know-how is held by a few firms (TSMC, Samsung, Intel).
  • Infrastructure: need for uninterrupted power and ultra-pure water in large volumes.
  • Supply chain: specialty gases, chemicals, equipment all imported.
  • Skills: India has many chip designers but few fab engineers.
  • Competition: US CHIPS Act, EU and East Asian subsidies.

India Semiconductor Mission (ISM)

  • Set up in December 2021 under the Ministry of Electronics and IT with an outlay of ₹76,000 crore.
  • Up to 50% fiscal support for fabs, display fabs, compound semiconductors and ATMP/OSAT units, with State support on top.
  • Design Linked Incentive scheme for start-ups and chip design.
  • Modernisation of the Semi-Conductor Laboratory, Mohali.
  • Skilling through Chips to Startup programme.

Progress

  • Micron's ATMP plant at Sanand; Tata Electronics with PSMC building a fab at Dholera; Tata, CG Power and Kaynes OSAT units.
  • About ten projects approved by 2025; first domestically packaged chips expected in 2025.

India can begin with mature nodes and packaging, where demand is large, and climb up gradually. Steady policy over a decade is the real requirement.

Keywords, cases and data to drop in

ISM 2021 ₹76,000 crore 50% fiscal support DLI Micron Sanand Tata-PSMC Dholera

Where most answers lose marks

  • Not separating design, fab and ATMP.

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Learn the concept

Question text as printed in the official UPSC question paper: https://www.upsc.gov.in/sites/default/files/GENERAL-STUDIES-PAPER-III-QP-CSM-25-010925.pdf The model answer is original Battle IAS work; use it to learn structure, not to memorise.